BENTLY 106M1081-01位移監(jiān)測器
初始化IBC中的PIRQx（PCI中斷）路由控制寄存器（PCI/ISA總線橋控制器）。ENV參數(shù)是一個32位值，該值除以4得到路由控制寄存器PIRQ0/1/2/3的值。默認值由系統(tǒng)類型決定。有關PCI/ISA中斷的詳細信息賦值和有關為此參數(shù)輸入的建議值，請參閱8259中斷MVME2600/2700系列單板中的部分計算機程序員參考指南。
BENTLY 106M1081-01位移監(jiān)測器配置VMEbus接口ENV提出了以下一系列問題來設置VMEbus接口適用于MVME2600/MVME2700/MVME3600/MVME4600系列VME模塊。要執(zhí)行此配置，您應該有一個程序員手冊中描述的Universe II ASIC知識參考指南。MVME2700板規(guī)格表A-1列出了MVME2700系列VME的一般規(guī)范模塊。后續(xù)章節(jié)詳細介紹了冷卻要求和FCC順從MVME2700的完整功能描述見第3章，功能描述?？蛇xPCI的規(guī)格夾層可以在這些模塊的文檔中找到。冷卻要求指定了摩托羅拉MVME2700系列單板計算機，經(jīng)過設計和測試，可在進氣溫度下可靠運行范圍為0°至55°C（32°至131°F），整個系統(tǒng)強制風冷組裝（基板和模塊）的速度通?？梢酝ㄟ^以下方式實現(xiàn)：使用100 CFM軸流風機。溫度鑒定在標準摩托羅拉VME系統(tǒng)機箱。25瓦負荷板插入兩個卡槽中，每側一個，與下面的板相測試，以模擬高功率密度系統(tǒng)配置。大會三個軸流風機中，每個風機的額定功率為100 CFM，直接放置在VME卡固定框架。進氣溫度是在風機組件和卡籠，其中首先進入氣流遇到被測模塊。測試軟件作為模塊執(zhí)行受到環(huán)境溫度變化的影響。外殼溫度監(jiān)控關鍵的高功率密度集成電路，以確保未超過組件供應商的規(guī)格。而冷卻所需的確切風量取決于環(huán)境空氣溫度和電路板的類型、數(shù)量和位置，以及對于其他熱源，通常可以使用10 CFM實現(xiàn)充分冷卻490線性調(diào)頻流過模塊。需要更少的氣流來冷卻具有較低最大環(huán)境的環(huán)境中的模塊。在“更多”下良好的熱條件下，可以操作模塊在高于55°C且氣流增加的情況下可靠運行。值得注意的是除了空氣動力裝置的額定CFM外，還有幾個因素，這決定了空氣流過管道的實際體積和速度單元
Initializes the PIRQx (PCI Interrupts) route control registers in the IBC
(PCI/ISA bus bridge controller). The ENV parameter is a 32-bit value that
is divided by 4 to yield the values for route control registers PIRQ0/1/2/3.
The default is determined by system type. For details on PCI/ISA interrupt
assignments and for suggested values to enter for this parameter, refer to
the 8259 Interrupts section in the MVME2600/2700 Series Single Board
Computer Programmer’s Reference Guide.Configure the VMEbus Interface
ENV asks the following series of questions to set up the VMEbus interface
for MVME2600/MVME2700/MVME3600/MVME4600 series VME
modules. To perform this configuration, you should have a working
knowledge of the Universe II ASIC as described in the Programmer’s
Reference Guide.MVME2700 Board Specifications
Table A-1 lists the general specifications for MVME2700 series VME
modules. Subsequent sections detail cooling requirements and FCC
compliance.
A complete functional description of the MVME2700 appears in
Chapter 3, Functional Description. Specifications for the optional PCI
mezzanines can be found in the documentation for those modules.Cooling Requirements
The Motorola MVME2700 family of single board computers is specified,
designed, and tested to operate reliably with an incoming air temperature
range from 0° to 55° C (32° to 131° F) with forced air cooling of the entire
assembly (base board and modules) at a velocity typically achievable by
using a 100 CFM axial fan. Temperature qualification is performed in a
standard Motorola VME system chassis. Twenty-five-watt load boards are
inserted in two card slots, one on each side, adjacent to the board under
test, to simulate a high power density system configuration. An assembly
of three axial fans, rated at 100 CFM per fan, is placed directly under the
VME card cage. The incoming air temperature is measured between the
fan assembly and the card cage, where the incoming airstream first
encounters the module under test. Test software is executed as the module
is subjected to ambient temperature variations. Case temperatures of
critical, high power density integrated circuits are monitored to ensure
component vendors’ specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the module. Less airflow is required to cool the
module in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the module
reliably at higher than 55° C with increased airflow. It is important to note
that there are several factors, in addition to the rated CFM of the air mover,
which determine the actual volume and speed of air flowing over a
module.
